- All sections
- C - Chemistry; metallurgy
- C09J - Adhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of materials as adhesives
- C09J 11/00 - Features of adhesives not provided for in group , e.g. additives
Patent holdings for IPC class C09J 11/00
Total number of patents in this class: 653
10-year publication summary
|
62
|
47
|
42
|
44
|
49
|
51
|
35
|
43
|
21
|
3
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| LG Chem, Ltd. | 17205 |
48 |
| Nitto Denko Corporation | 7879 |
40 |
| 3m Innovative Properties Company | 18406 |
28 |
| Henkel AG & Co. KGaA | 10129 |
27 |
| Henkel IP & Holding GmbH | 684 |
19 |
| Sekisui Chemical Co., Ltd. | 3159 |
18 |
| DONGWOO FINE-CHEM Co., Ltd. | 1163 |
16 |
| Dexerials Corporation | 1826 |
15 |
| Henkel Corporation | 1262 |
15 |
| LG Hausys, Ltd. | 839 |
13 |
| Hitachi Chemical Company, Ltd. | 2455 |
12 |
| Lintec Corporation | 1915 |
11 |
| Sony Chemical & Information Device Corporation | 268 |
8 |
| Cheil Industries Inc. | 944 |
7 |
| Namics Corporation | 393 |
7 |
| Dow Corning Toray Co., Ltd. | 562 |
6 |
| Henkel US IP LLC | 28 |
6 |
| Three Bond Co., Ltd. | 209 |
5 |
| Toyobo Co., Ltd. | 2286 |
5 |
| Brother Industries, Ltd. | 13000 |
4 |
| Other owners | 343 |